--------[ CPU ]---------------------------------------------------------------------------------------------------------
CPU Properties:
CPU Type Intel Pentium 4, 1800 MHz (18 x 100)
CPU Alias P68, Willamette, A80528
CPU Stepping D0
Instruction Set x86, MMX, SSE, SSE2
Original Clock 1800 MHz
Engineering Sample No
L1 Trace Cache 12K Instructions
L1 Data Cache 8 KB
L2 Cache 256 KB (On-Die, ECC, ATC, Full-Speed)
CPU Physical Info:
Package Type 478 Pin uPGA
Package Size 3.50 cm x 3.50 cm
Transistors 42 million
Process Technology 6M, 0.18 um, CMOS
Die Size 217 mm2
Core Voltage 1.75 V
I/O Voltage 1.75 V
Typical Power 55.3 - 75.3 W (depending on clock speed)
Maximum Power 72 - 100 W (depending on clock speed)
CPU Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/processor.htm
CPU Utilization:
CPU #1 0 %
--------[ CPUID ]-------------------------------------------------------------------------------------------------------
CPUID Properties:
CPUID Manufacturer GenuineIntel
CPUID CPU Name Intel(R) Pentium(R) 4 CPU 1.80GHz
CPUID Revision 00000F12h
IA Brand ID 08h (Intel Pentium 4)
Platform ID 0Eh (Socket 478)
IA CPU Serial Number Unknown
Microcode Update Revision 2E
HTT / CMP Units 0 / 0
Instruction Set:
64-bit x86 Extension (AMD64, EM64T) Not Supported
Alternate Instruction Set Not Supported
AMD 3DNow! Not Supported
AMD 3DNow! Professional Not Supported
AMD Enhanced 3DNow! Not Supported
AMD Extended MMX Not Supported
Cyrix Extended MMX Not Supported
IA-64 Not Supported
IA MMX Supported
IA SSE Supported
IA SSE 2 Supported
IA SSE 3 Not Supported
CLFLUSH Instruction Supported
CMPXCHG8B Instruction Supported
CMPXCHG16B Instruction Not Supported
Conditional Move Instruction Supported
MONITOR / MWAIT Instruction Not Supported
RDTSCP Instruction Not Supported
SYSCALL / SYSRET Instruction Not Supported
SYSENTER / SYSEXIT Instruction Supported
VIA FEMMS Instruction Not Supported
Security Features:
Advanced Cryptography Engine (ACE) Not Supported
Data Execution Prevention (DEP, NX, EDB) Not Supported
Hardware Random Number Generator (RNG) Not Supported
Montgomery Multiplier & Hash Engine Not Supported
Processor Serial Number (PSN) Not Supported
Power Management Features:
Automatic Clock Control Supported
Enhanced Halt State (C1E) Not Supported
Enhanced SpeedStep Technology (EIST, ESS) Not Supported
Frequency ID Control Not Supported
LongRun Not Supported
LongRun Table Interface Not Supported
PowerSaver 1.0 Not Supported
PowerSaver 2.0 Not Supported
PowerSaver 3.0 Not Supported
Processor Duty Cycle Control Supported
Software Thermal Control Not Supported
Temperature Sensing Diode Not Supported
Thermal Monitor 1 Supported
Thermal Monitor 2 Not Supported
Thermal Monitoring Not Supported
Thermal Trip Not Supported
Voltage ID Control Not Supported
CPUID Features:
36-bit Page Size Extension Supported
Address Region Registers (ARR) Not Supported
CPL Qualified Debug Store Not Supported
Debug Trace Store Supported
Debugging Extension Supported
Fast Save & Restore Supported
Hyper-Threading Technology (HTT) Not Supported
L1 Context ID Not Supported
Local APIC On Chip Supported
Machine Check Architecture (MCA) Supported
Machine Check Exception (MCE) Supported
Memory Configuration Registers (MCR) Not Supported
Memory Type Range Registers (MTRR) Supported
Model Specific Registers (MSR) Supported
Page Attribute Table (PAT) Supported
Page Global Extension Supported
Page Size Extension (PSE) Supported
Pending Break Event Not Supported
Physical Address Extension (PAE) Supported
Secure Virtual Machine Extensions (Pacifica) Not Supported
Self-Snoop Supported
Time Stamp Counter (TSC) Supported
Virtual Machine Extensions (Vanderpool) Not Supported
Virtual Mode Extension Supported
CPUID Registers (CPU #1):
CPUID 00000000 00000002-756E6547-6C65746E-49656E69
CPUID 00000001 00000F12-00010808-00000000-3FEBFBFF
CPUID 00000002 665B5001-00000000-00000000-007A7040
CPUID 80000000 80000004-00000000-00000000-00000000
CPUID 80000001 00000000-00000000-00000000-00000000
CPUID 80000002 20202020-20202020-20202020-6E492020
CPUID 80000003 286C6574-50202952-69746E65-52286D75
CPUID 80000004 20342029-20555043-30382E31-007A4847
MSR Registers:
MSR 00000017 0008-0000-0000-0000
MSR 0000002A 0000-0000-0000-4200
MSR 0000002C 0000-0000-9201-FC00
MSR 0000008B 0000-002E-0000-0000
MSR 0000019A 0000-0000-0000-0000
MSR 0000019B 0000-0000-0000-0000
MSR 0000019C 0000-0000-0000-0002
MSR 000001A0 0000-0000-0000-00C9
--------[ Motherboard ]-------------------------------------------------------------------------------------------------
Motherboard Properties:
Motherboard ID <DMI>
Motherboard Name Dell Dimension 8200
Front Side Bus Properties:
Bus Type Intel NetBurst
Bus Width 64-bit
Real Clock 100 MHz (QDR)
Effective Clock 400 MHz
Bandwidth 3200 MB/s
Memory Bus Properties:
Bus Type Dual RDRAM
Bus Width 32-bit
Real Clock 400 MHz (DDR)
Effective Clock 800 MHz
Bandwidth 3200 MB/s
Motherboard Manufacturer:
Company Name Dell Computer Corporation
Product Information http://www.dell.com
BIOS Download http://support.dell.com
--------[ Memory ]------------------------------------------------------------------------------------------------------
Physical Memory:
Total 639 MB
Used 484 MB
Free 154 MB
Utilization 76 %
Swap Space:
Total 1564 MB
Used 624 MB
Free 939 MB
Utilization 40 %
Virtual Memory:
Total 2203 MB
Used 1109 MB
Free 1093 MB
Utilization 50 %
Physical Address Extension (PAE):
Supported by Operating System Yes
Supported by CPU Yes
Active No
--------[ SPD ]---------------------------------------------------------------------------------------------------------
[ RIMM1: Samsung MR16R 1628AF0-CK8 ]
Memory Module Properties:
Module Name Samsung MR16R 1628AF0-CK8
Serial Number 7633B90Ch
Manufacture Date Week 40 / 2002
Module Size 256 MB (8 devices, 32 banks)
Module Type RIMM Module
Memory Type RDRAM
Memory Speed PC800 (400 MHz)
Module Width 16 bit
Module Voltage 2.5 V
Memory Module Features:
HeatSpreader Present
Thermal Sensor Not Present
Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm
[ RIMM2: Samsung MR16R 1628AF0-CK8 ]
Memory Module Properties:
Module Name Samsung MR16R 1628AF0-CK8
Serial Number 75958A0Fh
Manufacture Date Week 40 / 2002
Module Size 256 MB (8 devices, 32 banks)
Module Type RIMM Module
Memory Type RDRAM
Memory Speed PC800 (400 MHz)
Module Width 16 bit
Module Voltage 2.5 V
Memory Module Features:
HeatSpreader Present
Thermal Sensor Not Present
Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm
[ RIMM3: Samsung MR16R 0824BN1-CK8 ]
Memory Module Properties:
Module Name Samsung MR16R 0824BN1-CK8
Serial Number 3AD7BA1Eh
Manufacture Date Week 12 / 2002
Module Size 64 MB (4 devices, 32 banks)
Module Type RIMM Module
Memory Type RDRAM
Memory Speed PC800 (400 MHz)
Module Width 16 bit
Module Voltage 2.5 V
Memory Module Features:
HeatSpreader Present
Thermal Sensor Not Present
Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm
[ RIMM4: Samsung MR16R 0824BN1-CK8 ]
Memory Module Properties:
Module Name Samsung MR16R 0824BN1-CK8
Serial Number 3A18BB1Eh
Manufacture Date Week 12 / 2002
Module Size 64 MB (4 devices, 32 banks)
Module Type RIMM Module
Memory Type RDRAM
Memory Speed PC800 (400 MHz)
Module Width 16 bit
Module Voltage 2.5 V
Memory Module Features:
HeatSpreader Present
Thermal Sensor Not Present
Memory Module Manufacturer:
Company Name Samsung
Product Information http://www.samsung.com/Products/Semiconductor/DRAM/index.htm
--------[ Chipset ]-----------------------------------------------------------------------------------------------------
[ North Bridge: Intel Tehama i850(E) ]
North Bridge Properties:
North Bridge Intel Tehama i850(E)
Revision / Stepping 04 / A3
Package Type 615 Pin OLGA
Package Size 3.1 cm x 3.5 cm
Core Voltage 1.8 V
In-Order Queue Depth 8
Memory Controller:
Type Dual Channel (32-bit)
Active Mode Dual Channel (32-bit)
Memory Timings:
CAS Access Delay (tCAC) 8T
Row To Column Delay (tRCD) 9T
Roundtrip Channel Delay (tRDLY) 2T
Error Correction:
ECC Supported, Disabled
ChipKill ECC Not Supported
RAID Not Supported
ECC Scrubbing Not Supported
Memory Slots:
DRAM Slot #1 256 MB (PC800 RDRAM)
DRAM Slot #2 256 MB (PC800 RDRAM)
DRAM Slot #3 128 MB (PC800 RDRAM)
AGP Controller:
AGP Version 2.00
AGP Status Enabled
AGP Device MSI G3Ti200 Pro (MS-8850)
AGP Aperture Size 128 MB
Supported AGP Speeds 1x, 2x, 4x
Current AGP Speed 4x
Fast-Write Supported, Enabled
Side Band Addressing Supported, Disabled
Chipset Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/chipsets.htm
Driver Download http://support.intel.com/support/chipsets/index.htm
[ South Bridge: Intel 82801BA ICH2 ]
South Bridge Properties:
South Bridge Intel 82801BA ICH2
Revision / Stepping 04 / B4
Package Type 360 Pin EBGA
Package Size 2.3 cm x 2.3 cm
Core Voltage 1.8 V
Chipset Manufacturer:
Company Name Intel Corporation
Product Information http://www.intel.com/products/browse/chipsets.htm
Driver Download http://support.intel.com/support/chipsets/index.htm
--------[ BIOS ]--------------------------------------------------------------------------------------------------------
BIOS Properties:
BIOS Type Phoenix
System BIOS Date 04/18/02
Video BIOS Date 08/24/01
BIOS Manufacturer:
Company Name Phoenix Technologies Ltd.
Product Information http://www.phoenix.com/en/products/default.htm
BIOS Upgrades http://www.esupport.com/biosagent/index.cfm?refererid=40